bumping technology meaning in Chinese
隆起焊盘形成技术
Examples
- Investigation of electroless nickel gold bump technology
芯片封装技术的发展演变 - A novel flexible bumps technology for fc and wlp
凸点芯片倒装焊接技术 - Lead - free solder bumping technology for wafer level package
圆片级封装的无铅焊料凸点制作技术研究 - Wafer bumping technology for wlp
圆片级封装的凸点制作技术